1、 Fit of fingerprint module
DAF glue CCD alignment fitting, cover plate alignment fitting, defoaming.
1. The suction head automatically absorbs the film from the die-cut DAF coil belt, moves it to the lower CCD for photographing, the assembly line upload fixture moves to the fitting position and is jacked up, the upper CCD takes photos, the suction head carries out alignment preloading fitting, and the whole vehicle moves to this position through the assembly line after fitting.
2. Tear off the protective film of DAF glue, take out the cover plate from the material box by the manipulator and place it on the rotary table. The suction head on the other side of the rotary table is sucking the material at the same time, move to the lower CCD to take photos, the assembly line upload fixture moves to the fitting position and is jacked up, the upper CCD takes photos, the suction head carries out alignment pre pressing and fitting, and the whole vehicle moves to this pressing position through the assembly line after fitting.
3. DAF glue is defoaming under high temperature and pressure.

2、 Baking of chips after dispensing or DAF bonding before packaging.
1. Traditional high-temperature online oven (nitrogen can be filled according to oxygen content)

2. Vacuum high temperature oven
3. Pressure high-temperature oven, multi-stage lifting and cooling, high-precision multi temperature zone temperature control effectively solves the problem of bubble fitting.